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Power chips are attached to outside circuits via packaging, and their performance depends upon the assistance of the packaging. In high-power situations, power chips are generally packaged as power modules. Chip affiliation refers to the electric link on the upper surface of the chip, which is typically light weight aluminum bonding wire in conventional modules. ^
Traditional power module package cross-section

Currently, industrial silicon carbide power components still primarily use the packaging innovation of this wire-bonded conventional silicon IGBT module. They encounter troubles such as big high-frequency parasitic criteria, insufficient heat dissipation capacity, low-temperature resistance, and not enough insulation strength, which limit making use of silicon carbide semiconductors. The screen of excellent performance. In order to resolve these troubles and completely make use of the big prospective advantages of silicon carbide chips, lots of brand-new packaging innovations and solutions for silicon carbide power components have arised in recent times.

Silicon carbide power module bonding approach

(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)

Bonding materials have developed from gold wire bonding in 2001 to aluminum cord (tape) bonding in 2006, copper wire bonding in 2011, and Cu Clip bonding in 2016. Low-power tools have developed from gold wires to copper wires, and the driving force is cost decrease; high-power gadgets have actually established from aluminum wires (strips) to Cu Clips, and the driving force is to improve item efficiency. The greater the power, the higher the requirements.

Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging process that makes use of a solid copper bridge soldered to solder to link chips and pins. Compared with standard bonding product packaging techniques, Cu Clip innovation has the complying with advantages:

1. The link between the chip and the pins is constructed from copper sheets, which, to a particular extent, changes the common wire bonding technique between the chip and the pins. For that reason, a special plan resistance value, greater existing circulation, and better thermal conductivity can be acquired.

2. The lead pin welding location does not need to be silver-plated, which can totally conserve the price of silver plating and bad silver plating.

3. The product appearance is completely regular with typical products and is generally made use of in web servers, portable computer systems, batteries/drives, graphics cards, electric motors, power products, and various other fields.

Cu Clip has two bonding methods.

All copper sheet bonding technique

Both the Gate pad and the Resource pad are clip-based. This bonding approach is more expensive and complicated, but it can achieve better Rdson and much better thermal results.

( copper strip)

Copper sheet plus cord bonding method

The resource pad makes use of a Clip method, and the Gate makes use of a Cord approach. This bonding method is a little more affordable than the all-copper bonding method, saving wafer area (suitable to extremely little gateway areas). The process is less complex than the all-copper bonding approach and can get much better Rdson and better thermal impact.

Vendor of Copper Strip

TRUNNANO is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding copper rod, please feel free to contact us and send an inquiry.

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